History of LAPIS Technology

* Includes the device achievement of Oki Electric Industry Co., Ltd. , OKI SEMICONDUCTOR CO., LTD., and LAPIS Semiconductor Co., Ltd. which are the predecessor of LAPIS Technology Co., Ltd.

1961

Showa36th

Facilities
Building No.1 completed
 
Products
Production of transistors
 

1962

Showa37th

Facilities
Building No.2 and No.3 completed
Building No.2 and No.3 completed

Full view of Hachioji plant

Products
Production of millimeter wave tubes and electronic computers
Various electron tubes

Various electron tubes

1965

Showa40th

Products
Production of reed relays / Development of ICs started
リードリレー、IC

Reed relay at that time

1966

Showa41th

Products
Production of reed switches
 

1967

Showa42th

Products
Production of ICs
IC生産開始

Production line at that time

1968

Showa43th

Products
Development CMOS ICs started
 

1969

Showa44th

Facilities
Building No.4 completed
 
Products
Production of printed circuit boards
 

1975

Showa50th

Facilities
Operations begun at Chichibu plant
秩父工場

Chichibu plant

Products
Production of 4Kb DRAM
 

1977

Showa52th

Facilities
VLSI Laboratory No.1 completed
 
Products
Production of microprocessors
 

1979

Showa54th

Products
Production of microcomputers
 

1980

Showa55th

Facilities
Administration / Technology Center completed
 

1981

Showa56th

Facilities
Operations begun at Miyazaki Oki Electric
宮崎沖電気

M1 Plant at Miyazaki Oki Electric

Products
Production of gate arrays and 64kb DRAMs (3µm design rules used)
 

1982

Showa57th

Technologies
Technology transfer to National Semiconductor Inc.
 

1983

Showa58th

Facilities
VLSI Laboratory No.2 completed
 
Facilities
M2 Plant completed at Miyazaki Oki Electric
宮崎沖電気M2棟

M2 Plant at Miyazaki Oki Electric

1984

Showa59th

Facilities
Oki Micro Design Miyazaki established
 
Products
Production of 256kb DRAMs (2µm design rules used)
 

1985

Showa60th

Facilities
VLSI Laboratory No.3 completed
 

1987

Showa62th

Products
Production of 1Mb DRAMs (1.2µm design rules used)
 

1988

Showa63th

Facilities
Operations begun at Miyagi Oki Electric
宮城沖電気

Miyazaki Oki Electric

1989

Heisei1th

Facilities
Production of 4Mb DRAMs (0.8µm design rules used)
 

1990

Heisei2th

Facilities
Operation begun at Oregon Plant in U.S.
Oregon Plant

Oregon Plant

Facilities
Oki LSI Technology Kansai established)
 

1991

Heisei3th

Facilities
M3 Plant completed at Miyazaki Oki Electric
 

1992

Heisei4th

Facilities
Operations begun at Thailand Plant
Thailand Plant

Thailand Plant

Facilities
ULSI Laboratory No.1 completed
 
Products
Production of 16 Mb DRAMs (0.5µm design rules used)
16M DRAM Pattern

16M DRAM Pattern

1994

Heisei6th

Products
256Mb DRAMs (0.25µm design rules used) successfully developed
 

1995

Heisei7th

Facilities
S2 Plant completed at Miyazaki Oki Electric
 
Products
Production of SSD cards
 

1996

Heisei8th

Facilities
New Cafeteria Building completed (Building No.6)
 

1997

Heisei9th

Facilities
New Administration/Technology Center completed (Building No.7)
 
Products
Production of 64Mb DRAMs (0.3µm design rules used)
 
Products
1Gb DRAMs (0.18µm design rules used) successfully developed
 

1998

Heisei10th

Products
Business based SPA started
 
Products
Surface-mount Optical Network Modules commercialized
 
Products
USB Control LSIs commercialized
 

2000

Heisei12th

Products
Bluetooth System LSIs commercialized
 
Products
µPLAT developed
 

2002

Heisei14th

Products
Production of LSIs using Fully Depleted SOI-CMOS technology
 

2003

Heisei15th

Products
Long-Wave Time Code Receiver based on SOI-CMOS technology successfully developed, an industry first
 

2004

Heisei16th

Products
Semiconductor Bases in Shenzhen, Beijing and Shanghai established
 

2005

Heisei17th

Facilities
Semiconductor Business Group established
 

2007

Heisei19th

Facilities
Silicon Microdevice Company established
 

2008

Heisei20th

Facilities
OKI SEMICONDUCTOR CO.,LTD. established
 

2011

Heisei23th

Facilities
The company name changed to LAPIS Semiconductor Co., Ltd.
 

2013

Heisei25th

Facilities
Moved the headquarter office at Shin－Yokohama.
Shin-Yokohama Headquarters

Shin-Yokohama Headquarters

2015

Heisei27th

Products
Production of Reference design for IoT：Lazurite
Production of Reference design for IoT：Lazurite

Lazurite

Products
Development of Soil Sensor
Development of Soil Sensor

Development of Soil Sensor

2017

Heisei29th

Products
Commercialization of Low Power Wide Area Transceiver LSI
 

2020

Reiwa2th

Facilities
LAPIS Technology Co., Ltd. established as LSI design company Spun out of LAPIS Semiconductor
LAPIS Technology logo

LAPIS Technology logo