History of LAPIS Technology
* Includes the device achievement of Oki Electric Industry Co., Ltd. , OKI SEMICONDUCTOR CO., LTD., and LAPIS Semiconductor Co., Ltd. which are the predecessor of LAPIS Technology Co., Ltd.
1961
Showa36th
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FacilitiesBuilding No.1 completedProductsProduction of transistors
1962
Showa37th
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FacilitiesBuilding No.2 and No.3 completed
Full view of Hachioji plant
ProductsProduction of millimeter wave tubes and electronic computersVarious electron tubes
1965
Showa40th
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ProductsProduction of reed relays / Development of ICs started
Reed relay at that time
1966
Showa41th
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ProductsProduction of reed switches
1967
Showa42th
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ProductsProduction of ICs
Production line at that time
1968
Showa43th
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ProductsDevelopment CMOS ICs started
1969
Showa44th
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FacilitiesBuilding No.4 completedProductsProduction of printed circuit boards
1975
Showa50th
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FacilitiesOperations begun at Chichibu plant
Chichibu plant
ProductsProduction of 4Kb DRAM 1977
Showa52th
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FacilitiesVLSI Laboratory No.1 completedProductsProduction of microprocessors
1979
Showa54th
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ProductsProduction of microcomputers
1980
Showa55th
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FacilitiesAdministration / Technology Center completed
1981
Showa56th
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FacilitiesOperations begun at Miyazaki Oki Electric
M1 Plant at Miyazaki Oki Electric
ProductsProduction of gate arrays and 64kb DRAMs (3µm design rules used) 1982
Showa57th
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TechnologiesTechnology transfer to National Semiconductor Inc.
1983
Showa58th
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FacilitiesVLSI Laboratory No.2 completedFacilitiesM2 Plant completed at Miyazaki Oki Electric
M2 Plant at Miyazaki Oki Electric
1984
Showa59th
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FacilitiesOki Micro Design Miyazaki establishedProductsProduction of 256kb DRAMs (2µm design rules used)
1985
Showa60th
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FacilitiesVLSI Laboratory No.3 completed
1987
Showa62th
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ProductsProduction of 1Mb DRAMs (1.2µm design rules used)
1988
Showa63th
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FacilitiesOperations begun at Miyagi Oki Electric
Miyazaki Oki Electric
1989
Heisei1th
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FacilitiesProduction of 4Mb DRAMs (0.8µm design rules used)
1990
Heisei2th
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FacilitiesOperation begun at Oregon Plant in U.S.
Oregon Plant
FacilitiesOki LSI Technology Kansai established) 1991
Heisei3th
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FacilitiesM3 Plant completed at Miyazaki Oki Electric
1992
Heisei4th
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FacilitiesOperations begun at Thailand Plant
Thailand Plant
FacilitiesULSI Laboratory No.1 completedProductsProduction of 16 Mb DRAMs (0.5µm design rules used)16M DRAM Pattern
1994
Heisei6th
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Products256Mb DRAMs (0.25µm design rules used) successfully developed
1995
Heisei7th
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FacilitiesS2 Plant completed at Miyazaki Oki ElectricProductsProduction of SSD cards
1996
Heisei8th
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FacilitiesNew Cafeteria Building completed (Building No.6)
1997
Heisei9th
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FacilitiesNew Administration/Technology Center completed (Building No.7)ProductsProduction of 64Mb DRAMs (0.3µm design rules used)Products1Gb DRAMs (0.18µm design rules used) successfully developed
1998
Heisei10th
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ProductsBusiness based SPA startedProductsSurface-mount Optical Network Modules commercializedProductsUSB Control LSIs commercialized
2000
Heisei12th
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ProductsBluetooth System LSIs commercializedProductsµPLAT developed
2002
Heisei14th
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ProductsProduction of LSIs using Fully Depleted SOI-CMOS technology
2003
Heisei15th
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ProductsLong-Wave Time Code Receiver based on SOI-CMOS technology successfully developed, an industry first
2004
Heisei16th
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ProductsSemiconductor Bases in Shenzhen, Beijing and Shanghai established
2005
Heisei17th
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FacilitiesSemiconductor Business Group established
2007
Heisei19th
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FacilitiesSilicon Microdevice Company established
2008
Heisei20th
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FacilitiesOKI SEMICONDUCTOR CO.,LTD. established
2011
Heisei23th
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FacilitiesThe company name changed to LAPIS Semiconductor Co., Ltd.
2013
Heisei25th
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FacilitiesMoved the headquarter office at Shin-Yokohama.
Shin-Yokohama Headquarters
2015
Heisei27th
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ProductsProduction of Reference design for IoT:Lazurite
Lazurite
ProductsDevelopment of Soil SensorDevelopment of Soil Sensor
2017
Heisei29th
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ProductsCommercialization of Low Power Wide Area Transceiver LSI
2020
Reiwa2th
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FacilitiesLAPIS Technology Co., Ltd. established as LSI design company Spun out of LAPIS Semiconductor
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