The objectives of the existing LSI package technology are to protect the main body of LSIs from external environment and to mount LSIs on boards.
Currently, high-value addition is requested to the package itself for effective mounting as a result of the expansion of the application fields of LSI products and diversified package materials, sizes, and shapes.
Therefore, in the LSI development, package technology has been paid attention to as a strategically important technology as well as design technology and process technology.
LAPIS Technology contributes to customers with a wide array of package lineup and reliable technology based on the past performance which has been achieved by our active efforts in development of the package technology.