[WL-CSP]
Overview
World's smallest ultra-compact package
The conventional LSI package was a technology for protecting the LSI body from the outside and mounting it on a board.
Wafer-level CSP is the world's smallest ultra-small package that supports high performance and miniaturization represented by mobile devices.
LAPIS Technology develops based on the packaging technology cultivated for its own semiconductor devices, develops the latest package foundry services, and strongly supports customers' excellent product development.
Wafer-level CSP is the world's smallest ultra-small package that supports high performance and miniaturization represented by mobile devices.
LAPIS Technology develops based on the packaging technology cultivated for its own semiconductor devices, develops the latest package foundry services, and strongly supports customers' excellent product development.
Features
-
Ultra-small and lightweight! 10% of mounting area and 10% of weight * 1 Revolutionary small package
* 1: Compared with conventional 100-pin TQFP -
QFP/WCSP
Comparison
PKG
Size(mm2)
Mounting
area(mm2)
Terminal
pitch(mm)
weight
(g)
16
×
16256 0.5 0.26 5
×
525 0.5 0.03 -
Ultra-thin
-
Realized 0.3mm typ. Thickness
-
Easy handling
-
Since the device surface is sealed with resin, it can be mounted with a batch reflow device like a conventional package.
Excellent reflow resistance (JEDEC level 1) achieved by material / process technology.
-
Electrical characteristics
-
Excellent electrical characteristics can be realized by controlling wiring width, wiring length, multilayer wiring, etc.
Use
Semiconductor devices for small and lightweight devices such as mobile phones, smartphones, DSCs, cards, etc.
(Microcontroller, power supply IC, ASIC, sound source IC, RFIC, memory such as EEPROM, etc.)
(Microcontroller, power supply IC, ASIC, sound source IC, RFIC, memory such as EEPROM, etc.)
Reference reliability evaluation results
| High temperature operation test (Ta : 125°C、VDD : 3.6V) | 1000H Pass |
| High temperature storage test (Ta : 150°C) | 1000H Pass |
| High temperature and high humidity bias test (Ta : 85°C、RH : 85%、VDD : 3.6V) | 1000H Pass |
| Japanese steam unsaturated pressurization test (Ta : 121°C、RH : 85%) | 300H Pass |
| Temperature cycle test (-65°C to RT to 150°C) | 500cyc. Pass |
specification
| Item | specification |
|---|---|
| Wafer diameter | 6 inches, 8 inches |
| Terminal material | Eutectic, Pb-free（Sn-Ag-Cu） |
| Terminal shape | LGA、BGA |
| Terminal pitch | LGA：0.3mm、BGA：0.4mm |
Support
To promote customer development and achieve mass production goals
- Our quick response by direct access to key persons for each item
- Thermal resistance analysis, electrical characteristics analysis support
We will support you strongly.